BGA-484 (Ball Grid Array with 484 balls) is an advanced surface mount technology (SMT) packaging form, particularly suitable for high-performance and high-capacity integrated circuits. BGA packaging achieves connections on the circuit board by placing a series of solder balls (called solder balls or solder joints) at the bottom of the package, rather than traditional pins or leads.

characteristic:

High density: The BGA-484 package has a very high I/O (input/output) density and can provide up to 484 solder balls, suitable for complex integrated circuits that require a large number of connection points.

Excellent electrical performance: Due to the solder ball directly located at the bottom of the package, BGA packaging reduces the length of the signal path, thereby reducing inductance and capacitance, improving signal integrity and speed.

Good thermal performance: BGA packaging usually has good thermal conductivity because solder balls can directly transfer heat to the PCB, which helps with heat dissipation.

Miniaturization: Despite having a large amount of I/O, BGA packaging can still be designed very compactly, helping to achieve high-density circuit board layouts.

Reliability: BGA packaging is more reliable in mechanical impact and vibration environments due to the absence of exposed pins.

Structure:

The structure of BGA-484 package includes a multi-layer substrate made of plastic or ceramic, on which integrated circuit chips are installed. The bottom of the package is covered with regularly arranged solder balls, which connect with the solder pads on the PCB during reflow soldering.

Size:

The size of BGA-484 packaging may vary depending on the specific manufacturer and product model, but usually follows JEDEC standards. The size may vary greatly depending on the chip size, number of layers, and arrangement of solder balls inside the package.

Application:

BGA-484 packaging is commonly used in high-end applications such as server CPUs, high-performance computing (HPC) chips, large FPGAs, ASICs, network processors, graphics processing units (GPUs), etc. These applications typically require a significant amount of data transmission and processing capabilities, as well as efficient cooling solutions.

matters needing attention:

When designing and soldering BGA-484 packaging, the following points need to be noted:

Pad design: PCB design needs to be based on the pad layout provided by the manufacturer to ensure correct soldering and alignment.

Welding process: The welding of BGA packaging requires precise temperature control and time management, and X-ray inspection is usually used to verify the quality of the solder balls.

Thermal management: In high power applications, heat dissipation issues must be considered and may require the use of cooling solutions such as heat planes, heat sinks, or fans.

Difficulty in Repair: The repair of BGA packaging is more complex and difficult than traditional pin packaging, so reliability and maintainability need to be fully considered in the design phase.

When selecting BGA-484 packaging, reference should be made to the manufacturer's data manual and application notes for detailed dimensional information, recommended design guidelines, and welding process parameters. BGA-484 packaging plays an important role in modern electronic product design that requires extremely high integration and performance due to its high-density I/O and excellent performance.